Paper submission (firm!) Feb 28, 2007
Author notification Apr 19, 2007
Camera ready paper deadline (firm!) Apr 30, 2007
Author notification on May 5th
Camera ready deadline is scheduled on middle of June.
(exact date will be notified from publisher to authors)

With SPLC 2007, *the* premier forum for practitioners, researchers and educators to present and discuss the most recent ideas, innovations, trends, experiences, and concerns in the area software product lines and software product family engineering comes to Asia for the first time .

The objective is to continue the dialogue between software product line practitioners and researchers on the benefits, obstacles, and weaknesses of applying software product line principles, techniques, methods, processes, and tools in an industrial or organizational setting.

Topics of interest of SPLC 2007 include, but are definitely not restricted to:

• Industrial experiences in product line engineering
• Techniques and tools for product line engineering
• Evolution of product line assets
• Business issues for product lines
• Organizational and process issues for product lines
• Product line life-cycle issues

We invite three classes of original, unpublished submissions:

• RESEARCH PAPERS describe original research contribution (theoretical, conceptual) to the field of software product line engineering. A research paper should clearly describe the problem that has been tackled, the state of the art with respect to the problem, the solution that is suggested and the potential -- or even better the evaluated -- benefits of the contribution.
  We also call for short research papers, which are intended to report ideas in their early stages, and are not required to show complete/evaluated result.
• EXPERIENCE PAPERS describe the history of a software product line accompanied by a critical review of experience within one or more development phases within family and/or application engineering. An experience report describes lessons learned in domains of specific industries like automobile, mobile communication, embedded controller, or enterprise SW.
  We also call for short experience papers: Short experience papers are intended to report their useful and informative experiences briefly, and highlight their main interesting points.
• POSTERS describes research result or on-going research projects. They are displayed in a dedicated poster area at the conference, and presented in poster sessions.
  Poster papers will appear in a separate proceedings.

At least three members of the SPLC 2007 program committee will review each submission. The reviews will be the basis for making final decisions about which submissions to accept for presentation at the conference.

Each accepted paper submission will be allotted a maximum of ten pages (full papers) or six pages (short papers) in the conference proceedings. The final version of accepted papers must conform to the proceedings publication format.
Authors are required to present their work in a technical session.

Each accepted poster submission will allotted two pages in the separate proceedings. Poster format will be announced to accepted authors.
Authors are required to present their work in poster sessions.

PC members will vote for the best paper from full papers, but no paper may be selected if there is no agreement on the best paper.

Papers should be submitted in PDF format. The results described must be unpublished and should not be under review elsewhere.
Submitted papers must conform to the IEEE proceeding 8.5x11-inche, Two-Column Format (*), and should not exceed ten pages (including all text, figures, references and appendices).

(*) http://www.computer.org/portal/site/cscps/index.jsp INFORMATION FOR AUTHORS -> Formatting

Short research/experience papers are also conform the same format, and should not exceed six pages.

Poster papers are also conform the same format, and should not exceed two pages.

The submission deadline is firm! If you are unable to submit a paper electronically, please contact one of the two chairs at least two weeks prior to the submission deadline.

For more information about submissions, feel free to contact Tomoji Kishi (tkishi at jaist.ac.jp) and Dirk Muthig (dirk.muthig at iese.fraunhofer.de).